Leader in GaN AI ASIC power system chips
Product Center
Focusing on the research and industrialization of GaN HENT characteristic process integrated circuit technology, we are a company specializing in providing motion control ASIC chip solutions for robot propulsion system. The product series includes biomimetic cerebellar chips, intelligent joint control and drive chips, intelligent fast charging, and BMS battery safety management chips, which have entered large-scale commercial use. Obtained multiple invention patents in the field of "Robot Motion Control Algorithm". The company has won multiple second and third prizes in the ICCV International Artificial Intelligence Competition for three consecutive years, and won the CVPR championship at the International Robot Vision and Touch Summit in 2024.
RMC
An intelligent agent (Agent) ASIC motion control high-performance chip based on a robot model control architecture serves as a bridge connecting AI with the physical world, allowing robots to understand the logic behind the world just like humans.
Agt-ACT
Based on gallium nitride (GaN) integrated circuit technology, it achieves high frequency and high efficiency, high power density, low temperature rise, and rapid response, with a junction temperature reaching up to 225 °C. The intelligent joint chip has a built-in FOC algorithm, enabling robot actuators to develop towards lightweight and standardized designs, while addressing long-standing industry challenges in robot joints such as overheating, short battery life, slow response, and bulkiness.
RDP
Gallium Nitride (GaN) low-impedance, high electron mobility gallium integrated circuit 'digital power chip solution,' with built-in high-precision SOC, SOH, SOP AI electron mobility estimation algorithms. It is mainly used in aerospace, space robotics, smart equipment, digital inverters, new energy vehicles, new energy battery BMS management, safe charging, and other scenarios.
RDL
Gallium Nitride (GaN) millimeter-wave and millimeter-wave high electron mobility (PHEMT) amplifier and Transceiver chip solutions, mainly used in applications such as drones, robots, intelligent equipment, air-to-ground communication, space networking, and electronic countermeasures in complex electromagnetic environments.
News
Latest updates on products, markets, and events.
Zhongke Wireless Semiconductor has won the 20th Ch…
Chinese chip breakthrough! Zhongke Wireless Robot …
Break the bottleneck of power control! Zhongke Sem…
Recently, Zhongke Wireless Semiconductor stood out among 253 projects with its "Key Technology of High Performance Power System Chip for Tailo…
Farewell to Homogenized Competition! Domestic Robo…
Recently, CT Unit Wireless Semiconductor announced that its robot power system chip family has completed a key layout - the ASIC chips CT2001X and …
About Us
ZK Wireless Semiconductor, founded by an alumni team from the University of Science and Technology of China, consists of 7 professors and 11 PhD holders. It has extensive experience in the research and development of motion control analog computing chips and the industrialization of gallium integrated circuits, and has launched the world's first robot power system chip.
Company Overview
Zhongke Wireless Semiconductor Co., Ltd., abbreviated as "Zhongke Semiconductor", was founded in Hefei in 2011 and moved to Shenzhen, Guangdong in 2018. It is a military civilian integration enterprise founded by a team of alumni from the University of Science and Technology of China. It is composed of expert doctoral supervisors in the field of "third-generation semiconductor" analog chip design, including 7 professors and 11 PhDs. It has obtained 43 national defense and civil patents and has published a total of 250 papers. The team comes from the major military industrial institutes and the Semiconductor Research Institute of the Chinese Academy of Sciences, and has rich experience in compound power semiconductor research and development and industrialization. The chips developed include HEMT, PHEMT, GaN/SiC, Transceiver communication chips mini LED、micro LED、 Development of compound semiconductor epitaxial materials and development of sapphire substrate technology for growing aluminum oxide (AI2O3) materials. The product is mainly used in fields such as new energy, drones, unmanned equipment, Internet of Things, display panels, and fast charging.
Read detailDevelopment history
In 2023, gallium arsenide/gallium nitride HEMT/PHEMT, GaN epitaxy will enter the mass production stage; In 2023, the MiniLED 8-channel chip was verified to be qualified; Develop 48 channel chips; In 2022, SiP process design and mass production of IoT chips and SiP packaging machine image SOC+RFTransceiver will be achieved; Developing photonic microwave connectors in 2019.
Read detailCompany honors
The company is qualified as a national high-tech enterprise and a national software enterprise. Obtained 100 patents, 9 software copyrights, police probes, transparent algorithm encryption systems, etc., and received government funding (5 million yuan). Awarded as a member of the China Semiconductor Alliance and a partner of Huawei's 4G Smart Antenna and China Mobile's 5G Joint Innovation Center.
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